Chip-scale radio-frequency localization devices and associated systems and methods

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United States of America Patent

PATENT NO 10665923
APP PUB NO 20170179571A1
SERIAL NO

15382582

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Abstract

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A device comprising: a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency different than the first center frequency; and circuitry integrated with the semiconductor die and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna.

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Patent Owner(s)

  • HUMATICS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Charvat, Gregory L Guilford, US 141 6829
Mindell, David A Cambridge, US 32 943

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