ELECTRONIC CIRCUIT BOARD SHIELDING WITH OPEN WINDOW HEAT TRANSFER PATH
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United States of America Patent
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app pub date -
Dec 22, 2016
filing date -
Dec 22, 2015
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Abstract
An improved heat transfer system for components an electronic device is provided. The electronic device includes a printed circuit board, a component shield and a heatsink or heat spreader. An open heat transfer window is positioned in the component shield so as to enable the heat sink to directly contact a thermal pad for a component requiring heat dissipation. Grounding fingers between the shield and the heatsink may be provided to connect the shield to the heatsink, thereby protecting the component against electromagnetic interference and electrostatic discharge from the outside while preventing the component from leaking radio frequency radiation to the outside resulting from the creation of the open heat transfer window in the shield.
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