Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
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United States of America Patent
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Jul 7, 2020
Grant Date -
Jun 22, 2017
app pub date -
Apr 1, 2015
filing date -
Apr 2, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.
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