CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
Jun 29, 2017
app pub date -
Dec 28, 2016
filing date -
Dec 29, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A chip package including a substrate is provided. The substrate includes a front surface, a back surface, and a side surface. A redistribution layer is disposed on the back surface and is electrically connected to a sensing or device region in the substrate. A protection layer covers the redistribution layer and extends onto the side surface. A cover plate is disposed on the front surface and laterally protrudes from the protection layer on the side surface. The cover plate includes a first surface facing the front surface and a second surface facing away from the front surface. A bottom portion of the cover plate broadens from the first surface towards the second surface. A method of forming the chip package is also provided.
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