Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board
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United States of America Patent
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Sep 3, 2015
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Sep 19, 2014
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Abstract
There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.
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