METHACRYLIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME

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United States of America Patent

SERIAL NO

15320663

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Abstract

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In order to provide a methacrylic resin composition that maintains all of physical properties such as excellent solvent resistance, heat resistance, mechanical strength, and stringing resistance, and has particularly excellent fluidity and also heat stability, the present invention provides a methacrylic resin composition that satisfies conditions (I) through (IV) and includes two types of methacrylic resins having mutually different peak molecular weights. (I) The weight ratio of methyl methacrylate units in the methacrylic resin is greater than 98.5 wt % with respect to 100 wt % of all monomer units. (II) The HP value indicating the higher peak molecular weight satisfies the expression 180,000≦HP≦220,000. (III) The LP value indicating the lower peak molecular weight satisfies the expression 24,000≦LP≦35,000. (IV) The PR value indicated by a/b, where a is the value indicating peak height in the HP and b is the value indicating peak height in the LP on a differential molecular weight distribution curve, satisfies the expression 1.32≦PR≦1.60.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO CHEMICAL COMPANY LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KADOYA, Hidenori Ehime, JP 5 13
YAMAMORI, Akihiro Tokyo, JP 6 9
YAMAZAKI, Kazuhiro Ehime, JP 57 447

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