Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring

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United States of America Patent

PATENT NO 10134649
APP PUB NO 20170194221A1
SERIAL NO

14988893

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Abstract

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A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Davis, Taryn J Beacon, US 17 88
Fry, Jonathan R Fishkill, US 21 59
Sinha, Tuhin Hackensack, US 40 106

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