Importance

Loading Importance Indicators...

Abstract

A semiconductor device with etched grooves for embedded devices is disclosed and may, for example, include a substrate comprising a top surface and a bottom surface, a groove extending into the substrate from the bottom surface, and a redistribution structure in the substrate between the top surface and the bottom surface of the substrate. A semiconductor die may, for example, be coupled to the top surface of the substrate. An electronic device may, for example, be at least partially within the groove and electrically coupled to the redistribution structure. A conductive pad may, for example, be on the bottom surface of the substrate. A conductive bump may, for example, be on the conductive pad. The electronic device in the groove may, for example, extend beyond the bottom surface of the substrate a distance that is less than a height of the conductive bump from the bottom surface of the substrate. An encapsulant may, for example, encapsulate the semiconductor die and the top surface of the substrate. The electronic device may, for example, comprise a capacitor.

Loading the Abstract Image...

First Claim