THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
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United States of America Patent
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Mar 17, 2017
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May 27, 2015
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Abstract
A thermally enhanced semiconductor assembly with three dimensional integration includes a first component and a second component face-to-face mounted together. A heat spreader that provides an enhanced thermal characteristic for the semiconductor assembly is disposed in a through opening of a routing circuitry. Another routing circuitry disposed on the heat spreader not only provides mechanical support, but also allows heat spreading and electrical grounding for the heat spreader by metallized vias.
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