Vertical capacitor contact arrangement

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United States of America Patent

PATENT NO 10084035
APP PUB NO 20170194418A1
SERIAL NO

14985101

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Abstract

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An arrangement for making electrical contact to a vertical capacitor having top and bottom metal layers separated by a dielectric, and at least one trench. Recesses are formed in an oxide layer over the capacitor to provide access to the top and bottom metal layers. The recesses include contacting portions preferably positioned such that there is no overlap between them and any of the trenches. Metal in the recesses, preferably copper, forms electrical contacts to the vertical capacitor's metal layers and enables reliable bonding to copper metallization on other layers such as an ROIC layer. ‘Dummy’ capacitors may be tiled on portions of the IC where there are no vertical capacitors, preferably with the top surfaces of their top metal at a height approximately equal to that of the top surface of the vertical capacitor's top metal, thereby enabling the IC to be planarized with a uniform planarization thickness.

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Patent Owner(s)

  • TELEDYNE SCIENTIFIC & IMAGING, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeNatale, Jeffrey F Thousand Oaks, US 58 1134
Gulbransen, David J Thousand Oaks, US 10 64
Papavasiliou, Alexandros P Thousand Oaks, US 12 94
Roll, Alan Oak Park, US 1 12

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