Electrical component, in particular sensor, as well as manufacturing methods therefor
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United States of America Patent
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May 26, 2020
Grant Date -
Jul 13, 2017
app pub date -
Jan 13, 2017
filing date -
Jan 13, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In order to minimize a force transfer at electronic components (1), in particular sensors (1) whose electronic circuit in an interior of a housing (2) is encased by an initially liquid or highly viscous hardening encasement compound (20) at an increasing temperature from the hardened encasement compound to the electronic components (4, 24) it is proposed according to the invention to perform the encasement so that in the cured condition all required portions and components (4, 24) are covered by the encasement compound (20) but sufficient cavities (21.1, 22.2) remain in the interior spaces (14.1, 14.2) of the housing (2) so that the hardened encasement compound (20) can expand into the cavities.
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