MANUFACTURING METHOD OF MEMORY DEVICE

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United States of America Patent

SERIAL NO

15182062

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Abstract

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A manufacturing method for a memory device includes forming a stack structure over a substrate, forming a mask pattern over the stack structure, forming a first vertical hole by patterning the stack structure using the mask pattern, implanting a dopant into a sidewall of the first vertical hole to form a first region, wherein the first region is exposed by the mask pattern; and removing the first region to form a second vertical hole.

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Patent Owner(s)

Patent OwnerAddress
SK HYNIX INCGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Ki Hong Gyeonggi-do, KR 264 2668
PARK, In Su Gyeonggi-do, KR 68 167
YUN, Ki Jun Gyeonggi-do, KR 12 10

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