Importance

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Abstract

The disclosure generally relates to methods for manufacturing a filled gap region or cavity between two surfaces forming a device microchip. In one embodiment, the cavity results from two surfaces, for example, a PCB and a chip or two chips. More specifically, the disclosure relates to a method of manufacture and the resulting apparatus having porous underfill to enable rework of the electrical interconnects of a microchip on a multi-chip module. In one embodiment, the disclosure builds on the thermal underfill concept and achieves high thermal conductivity by the use of alumina fillers. Alternatively, other material such as silica filler particles may be selected to render the underfill a poor thermal conductive. In one embodiment, the disclose is concerned with reworkability of the material.

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First Claim