Multi-chip package with interconnects extending through logic chip
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United States of America Patent
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Nov 14, 2017
Issued Date -
N/A
app pub date -
Jan 19, 2017
filing date -
Jan 11, 2016
priority date (Note) -
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Abstract
A microelectronic package includes a first microelectronic element comprising logic circuitry which is flip-chip mounted to a substrate, the substrate having terminals for connection with a circuit panel or other external component. A second microelectronic element overlies a rear surface of the first microelectronic element and has contacts electrically coupled with the substrate through electrically conductive interconnects extending through a region of the first microelectronic element. A heat spreader is thermally coupled with the rear surface of the substrate, either directly or through an additional element overlying the rear surface. Additional contacts of the second microelectronic element may be coupled with contacts of the substrate through electrically conductive structure disposed beyond an edge surface of the first microelectronic element.
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