CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
Jul 20, 2017
app pub date -
Jan 18, 2017
filing date -
Jan 19, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A chip package is provided. The chip package includes a first chip including a carrier substrate and a device substrate thereon. A second chip is mounted on the device substrate. A portion of the device substrate extends outward from the edge of the second chip, so as to be exposed from the second chip. A conductive pad is between the device substrate and the second chip. A polymer protective layer conformally covers the second chip, the exposed portion of the device substrate, and the edge of the carrier substrate. A redistribution layer is disposed on the polymer protective layer and extends into a first opening that passes through the polymer protective layer and the second chip and exposes the conductive pad, so as to be electrically connected to the conductive pad.
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