CAP STRUCTURE FOR WAFER LEVEL PACKAGE
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United States of America Patent
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app pub date -
Dec 9, 2016
filing date -
Jan 20, 2016
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Abstract
A wafer level package (WLP) device includes a wafer level core and a cap structure. At least one component is formed in or on the wafer level core, and the cap structure resides on the top surface of the wafer level core and forms a cavity over the component. The cap structure includes a perimeter wall that rests on the top surface of the wafer level core and extends about the component. The perimeter wall has a top surface divided into a covered portion that extends along an inner portion and an uncovered portion that extends along an outer portion. The lid has a bottom surface, wherein an outer periphery of the bottom surface of the lid rests on and only covers the covered portion of the top surface of the perimeter wall.
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