Base film for sheets for semiconductor wafer processing, sheet for semiconductor wafer processing, and method of manufacturing semiconductor devices

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United States of America Patent

PATENT NO 10615070
SERIAL NO

15514842

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Abstract

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A base film for sheets for semiconductor wafer processing, comprising a resin layer (A) and a resin layer (B) laminated on one surface of the resin layer (A), wherein one surface of the base film for sheets for semiconductor wafer processing comprises a surface of the resin layer (B), the resin layer (A) contains a thermoplastic elastomer having a Vicat softening point of 50° C. or higher and 87° C. or lower, the resin layer (B) contains a thermoplastic elastomer having a Vicat softening point of 91° C. or higher and 220° C. or lower, and a thickness t of the base film for sheets for semiconductor wafer processing and a thickness tA of the resin layer (A) satisfy the Formulae (1) t≤150 μm and (2) tA/t≥78%.

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Patent Owner(s)

  • LINTEC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Masatomo Tokyo, JP 5 27
Yamashita, Shigeyuki Tokyo, JP 38 294

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