MEMS piezoelectric transducer formed at a PCB support structure

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United States of America Patent

PATENT NO 10763423
APP PUB NO 20170213955A1
SERIAL NO

15411971

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Abstract

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A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.

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Patent Owner(s)

Patent OwnerAddress
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT8700 LEOBEN-HINTERBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Renaud-Bezot, Nick Vienna, AT 9 32
Silvano, De Sousa Jonathan Vienna, AT 22 51

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