CORELESS SUBSTRATE HAVING PRIMER LAYERS ADJACENT TO BOTTOM AND TOP OUTER METAL LAYERS
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United States of America Patent
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app pub date -
Jan 27, 2016
filing date -
Jan 27, 2016
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Abstract
A coreless substrate of a printed circuit board is provided. The coreless substrate includes a first outer metal layer; a first primer layer formed on the first outer metal layer; a first layer of functional prepreg material formed on the first primer layer; a second primer layer formed over the first layer of functional prepreg material; and a second outer metal layer formed on the second primer layer. The first outer metal layer corresponds to a first outer most surface of the printed circuit board, and the second outer metal layer corresponds to a second outer most surface of the printed circuit board.
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