DIELECTRIC VIAS IN MULTI-LAYER STRUCTURES
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Jan 27, 2016
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Jan 27, 2016
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Abstract
An apparatus includes electrically conductive structures disposed over, or partially in, a dielectric layer. The dielectric layer has a first relative permittivity (∈r1). The apparatus also includes a dielectric via disposed in the dielectric layer. The dielectric via has a second relative permittivity (∈r2) that is less than the first relative permittivity (∈r1). The dielectric via is located in a region, or adjacent to the region, where a magnitude of an electric field between the first and second electrically conductive structures is comparatively large.
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