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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HAAS FOOD EQUIPMENT GMBH	GERSTLGASSE 25 WIEN A-1210

International Classification(s)

• A21D:TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH FO....
• A21C:MACHINES OR EQUIPMENT FOR MAKING OR PROCESSING DOU....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
DOLKOWSKI, MICHAEL	BADEN, AT	1	1
HAAS, JOHANNES	WIEN, AT	47	67
HAAS, JOSEF	LEOBENDORF, AT	54	88
JIRASCHEK, STEFAN	KOENIGSBRUNN, AT	59	60
KREINER, FLORIAN	ALTENWOERTH, AT	1	1
REITHNER, JUERGEN	SCHOENBERG AM KAMP, AT	3	1

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Feb 3, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Feb 3, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2017/0215,437

SYSTEM AND METHOD FOR FORMING WAFER BLOCKS

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