Method of Fabricating High-Conductivity Thick-film Copper Paste Coated with Nano-Silver for Being Sintered in the Air
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United States of America Patent
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Issued Date -
Aug 3, 2017
app pub date -
Feb 2, 2016
filing date -
Feb 2, 2016
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Abstract
A thick-film copper paste is made. A displacement reaction with low cost is used to precipitate nano-silver (Ag) to be grown on copper particles. Thus, the thick-film copper paste is made of the copper powder coated with nano-Ag. The paste can be sintered in the air and is increased in overall electrical conductivity. The copper inside is not oxidized. Its resistance on electromigration is good. Furthermore, the paste can be added with frit as a sintering aid to assist sintering the nano-Ag-coated copper paste. Furthermore, even in a high-temperature heat treatment, the powder of nano-Ag-coated copper is still antioxidant and can replace the silver paste used in the current market.
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