Semiconductor device and method for manufacturing semiconductor device

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United States of America Patent

PATENT NO 10038071
SERIAL NO

15410304

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Abstract

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A semiconductor device according to the present invention includes: a semiconductor layer including a first conductivity type semiconductor region and a second conductivity type semiconductor region joined to the first conductivity type semiconductor region; and a surface electrode connected to the second conductivity type region on one surface of the semiconductor layer, including a first Al-based electrode, a second Al-based electrode, an Al-based oxide film interposed between the first Al-based electrode and the second Al-based electrode, and a plated layer on the second Al-based electrode.

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Patent Owner(s)

  • ROHM CO., LTD.; LAPIS SEMICONDUCTOR CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hikasa, Akihiro Kyoto, JP 32 140
Kato, Kazusuke Miyazaki, JP 5 8

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