Methods of manufacturing flexible printed circuit boards

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United States of America Patent

PATENT NO 10617012
SERIAL NO

15427430

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Abstract

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A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer facing the temporary carrier such that the electronic component is pushed into the adhesive layer, and removing the temporary carrier. Further, a corresponding flexible electronic device is described.

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Patent Owner(s)

Patent OwnerAddress
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT8700 LEOBEN-HINTERBERG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Stahr, Johannes St. Lorenzen, AT 65 341
Zluc, Andreas Leoben, AT 36 184

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