Soluble material for three-dimensional molding

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United States of America Patent

PATENT NO 10954378
APP PUB NO 20170232684A1
SERIAL NO

15518910

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The soluble material for three-dimensional modeling of the present invention is a soluble material for three-dimensional modeling that is used as a material of a support material that supports a three-dimensional object when manufacturing the three-dimensional object with a fused deposition modeling type 3D printer. The soluble material for three-dimensional modeling contains at least one polymer and at least one filler. In the soluble material for three-dimensional modeling, the filler is a fibrous filler having a fiber length of 0.02 μm to 1,000 μm and a fiber diameter of 0.0001 μm to 20 μm and/or a flat filler having a particle size of 0.1 μm to 20 μm and a thickness of 0.01 μm to 10 μm. The content of the filler is 0.01 part by mass to 200 parts by mass with respect to 100 parts by mass of the polymer. According to the present invention, foaming and a decrease of the accuracy of a three-dimensional object can be suppressed even when the soluble material for three-dimensional modeling is used in manufacture of the three-dimensional object with a 3D printer after being exposed to high humidity.

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Patent Owner(s)

  • KAO CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Takuma Tokyo, JP 13 71
Yoshimura, Tadanori Wakayama, JP 22 71

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