ETCH CUTTING SOLUTION FOR USE ON GLASS SUBSTRATES
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Sep 14, 2015
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Sep 16, 2014
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Solutions suitable for etch cutting glass substrates are disclosed. The solutions can include: (a) about 20.1 to about 25 weight % of hydrofluoric acid; (b) about 7 to about 10.5 weight % of an organic carboxylic acid; (c) 0 to about 10 weight % of nitric acid; and (d) about 54.5 to about 72.9 weight % of water; wherein the weight % is based on the total weight of the etch cutting solution.
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