ALUMINUM-SILICON CARBIDE COMPOSITE AND PRODUCTION METHOD THEREFOR

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United States of America Patent

SERIAL NO

15500210

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Abstract

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An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≦Ax/B≦1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≦Ay/B≦1.00 and production method therefor.

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Patent Owner(s)

Patent OwnerAddress
DENKA COMPANY LIMITEDTOKYO 103-8338

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIROTSURU, Hideki Omuta-shi, JP 31 242
KINO, Motonori Omuta-shi, JP 5 4
MIYAKAWA, Takeshi Omuta-shi, JP 59 388

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