APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SEMICONDUCTOR DIE
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United States of America Patent
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Issued Date -
Aug 17, 2017
app pub date -
Feb 17, 2016
filing date -
Feb 17, 2016
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Abstract
Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plurality of die and a top surface of the bottom die extending beyond the plurality of die may be exposed. The barrier may be disposed alongside the plurality of die and the bottom die, and the heat spreader may be disposed over the exposed top surface of the bottom die and alongside the plurality of die.
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