LASER MANUFACTURING OF SOLDER PREFORMS
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United States of America Patent
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Feb 17, 2017
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Feb 19, 2016
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Abstract
Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.
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