POLYPHENYLENE ETHER RESIN COMPOSITION

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United States of America Patent

SERIAL NO

15047184

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Abstract

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It is intended to provide a polyphenylene ether resin composition that has favorable fluidity in molding while ensuring sufficiently high heat resistance and/or favorable mechanical properties. The present invention provides a polyphenylene ether resin composition comprising: 50% by mass or more and 99% by mass or less of a polyphenylene ether resin (A) having a reduced viscosity of 0.33 dl/g or more and 0.46 dl/g or less measured in an amount of 0.5 g/dl at 30° C. using a chloroform solvent; 0% by mass or more and 49% by mass or less of a polystyrene resin (B); and 1% by mass or more and 15% by mass or less of a styrene-acrylonitrile resin (C) having an acrylonitrile content of 16% by mass or more and 45% by mass or less.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CHEMICALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MITSUI, Akira Tokyo, JP 65 604
YAMAGUCHI, Toru Tokyo, JP 92 725

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