3D MICROMOLD AND PATTERN TRANSFER
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United States of America Patent
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Feb 23, 2017
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Feb 24, 2016
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Abstract
According to various aspects and embodiments, a system and method for forming a packaged electronic device is disclosed. One example of the method comprises treating a surface of a first substrate to create a first surface having a low bond strength, at least a portion of the first surface defined by at least one three-dimensional structure and a layer of optical masking material, depositing a layer of structure material onto at least a portion of the first surface, bonding a second substrate to at least a portion of the layer of structure material, and separating the first substrate from the second substrate along the first surface.
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