THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Aug 24, 2017
app pub date -
May 10, 2017
filing date -
May 27, 2015
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Abstract
A thermally enhanced semiconductor assembly with three dimensional integration includes a semiconductor chip electrically coupled to a wiring board by bonding wires. A heat spreader that provides an enhanced thermal characteristic for the semiconductor chip is disposed in a through opening of a wiring structure. Another wiring structure disposed on the heat spreader not only provides mechanical support, but also allows heat spreading and electrical grounding for the heat spreader by metallized vias. The bonding wires provide electrical connections between the semiconductor chip and the wiring board for interconnecting the semiconductor chip to terminal pads provided in the wiring board.
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