Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate

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United States of America Patent

PATENT NO 10804121
APP PUB NO 20170250097A1
SERIAL NO

15441709

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Abstract

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According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.

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Patent Owner(s)

Patent OwnerAddress
SHIBAURA MECHATRONICS CORPORATION5-1 KASAMA 2-CHOME SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-8610

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamada, Koichi Yokohama, JP 93 495
Kobayashi, Nobuo Yokohama, JP 144 1838

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