Manufacturing method of thermal module assembling structure

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United States of America Patent

PATENT NO 10016859
SERIAL NO

15060611

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Abstract

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A manufacturing method of thermal module assembling structure includes a step of making a heat pipe received in a channel of a base seat tightly fitted and inserted in the channel by means of mechanical processing so as to integrally connect the base seat with the heat pipe. The manufacturing method of thermal module assembling structure is able to effectively enhance the connection strength between the base seat and the heat pipe.

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Patent Owner(s)

  • ASIA VITAL COMPONENTS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Kuo-Sheng New Taipei, TW 42 67
Lin, Sheng-Huang New Taipei, TW 101 315

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