POLISHING PAD
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United States of America Patent
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app pub date -
Jul 30, 2015
filing date -
Aug 27, 2014
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Abstract
A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).
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