THERMOSETTING RESIN COMPOSITION

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United States of America Patent

SERIAL NO

15510457

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Abstract

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A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance.

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Patent Owner(s)

Patent OwnerAddress
TEIJIN LIMITED2-4 NAKANOSHIMA 3-CHOME KITA-KU OSAKA-SHI OSAKA 5300005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ENDO, Kouhei Osaka-shi, JP 7 24
SHIBANO, Masaya Osaka-shi, JP 4 5
SHOJI, Shinichiro Osaka-shi, JP 24 153

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