Silicon wafer polishing composition
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United States of America Patent
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Aug 18, 2020
Grant Date -
Sep 7, 2017
app pub date -
May 23, 2017
filing date -
Jun 7, 2013
priority date (Note) -
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Abstract
This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.
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