Insulating a via in a semiconductor substrate

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United States of America Patent

PATENT NO 10079175
APP PUB NO 20170256447A1
SERIAL NO

15601488

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Abstract

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Insulating a via in a semiconductor substrate, including: depositing, in the via, a dielectric layer; depositing, in the via, a barrier layer; allowing the barrier layer to oxidize; and depositing, in the via, a conducting layer.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farooq, Mukta G Hopewell Junction, US 212 3370
Oakley, Jennifer A Poughkeepsie, US 9 18
Petrarca, Kevin S Newburgh, US 117 1953
Reardon, Nicole R Fishkill, US 2 5
Simon, Andrew H Fishkill, US 104 1612

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