CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
Sep 7, 2017
app pub date -
Feb 23, 2017
filing date -
Mar 1, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A chip package including a substrate is provided. A sensing region or device region of the substrate is electrically connected to a conducting pad. A first insulating layer is disposed on the substrate. A redistribution layer is disposed on the first insulating layer. A first portion and a second portion of the redistribution layer are electrically connected to the conducting pad. A second insulating layer conformally extends on the first insulating layer, and covers side surfaces of the first portion and the second portion. A protection layer is disposed on the second insulating layer. A portion of the second insulating layer is located between the protection layer and the first insulating layer. A method of forming the chip package is also provided.
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