HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE
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United States of America Patent
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app pub date -
Jun 7, 2016
filing date -
Mar 2, 2016
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.
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