RESIN COMPOSITION AND USES OF THE SAME

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United States of America Patent

SERIAL NO

15174107

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Abstract

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A resin composition, comprising the following components:

    (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and(b) a metal hypophosphite of formula (I),

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Patent Owner(s)

Patent OwnerAddress
TAIWAN UNION TECHNOLOGY CORPORATIONNO 803 PO AI ST ZHUBEI CITY HSINCHU COUNTY TAIWAN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Huei Chupei City, TW 22 54
Liu, Shur-Fen Chupei City, TW 59 361

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