SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

SERIAL NO

15532015

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Abstract

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There is provided a technique of suppressing unintended substrate processing from being performed after predetermined substrate processing is ended, including a substrate support section that supports a substrate in a processing chamber; a processing gas supply section that supplies a processing gas into the processing chamber; and a moving mechanism that moves the substrate support section in the processing chamber, between a first position to which the processing gas supplied from the processing gas supply section is blown, and a second position to which the processing gas supplied from the processing gas supply section is not blown.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO CHEMICAL COMPANY LIMITED2-7-1 NIHONBASHI CHUO-KU TOKYO 1036020 ?1036020

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJIKURA, Hajime Hitachi-shi, JP 55 227
KONNO, Taichiro Hitachi-shi, JP 19 199
NONAKA, Takehiro Hitachi-shi, JP 4 33
NUMATA, Takayuki Hitachi-shi, JP 6 21

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