METHOD OF ARRANGING TREATMENT PROCESS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20170261258A1
SERIAL NO

15450876

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Abstract

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A method includes a step of increasing or decreasing a flow rate of a gas of the a second gas supply system, by a predetermined time from a start of a gas treatment step of the process recipe or a by a predetermined time before a start of the gas treatment step, by using apparatus information regarding a first gas supply system of the first substrate treatment apparatus and the second gas supply system of the second substrate treatment apparatus, and arranging the treatment process, and in this step, the treatment process of the second substrate treatment apparatus performed using the process recipe conforms to the treatment process of the first substrate treatment apparatus performed using the process recipe.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AMIKURA, Norihiko Kurokawa-gun, JP 29 109
HIROSE, Jun Kurokawa-gun, JP 72 894
MIYOSHI, Risako Kurokawa-gun, JP 16 15

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