WIRING BOARD WITH ELECTRICAL ISOLATOR AND BASE BOARD INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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May 25, 2017
filing date -
Mar 7, 2014
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Abstract
A wiring board includes an electrical isolator laterally surrounded by a base board and a molding compound. The electrical isolator is inserted into a through opening of the base board and has a thickness greater than that of the base board. The molding compound covers the top side of the base board and sidewalls of the electrical isolator, and provides a reliable interface for deposition of a routing circuitry thereon. The base board can serve as an alignment guide for isolator placement or/and provide another routing to enhance electrical routing flexibility for the wiring board.
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