THERMOELECTRIC STRUCTURE
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United States of America
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Issued Date -
Sep 14, 2017
app pub date -
Aug 8, 2016
filing date -
Aug 8, 2016
priority date (Note) -
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Abstract
The present disclosure provides a thermoelectric structure including a thermoelectric substrate and a barrier layer covering the thermoelectric substrate. A material of the barrier layer is metallic glass. The thermoelectric structure of the present disclosure may apply to a medium-temperature (about 400K to about 800K) thermoelectric module to effectively block the diffusion of the thermoelectric substrate.
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