Thermal Bonding of Multi-Layer Glass Capacitors

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United States of America Patent

SERIAL NO

15448250

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Abstract

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High energy density multi-layer capacitors comprise inner electrodes buried within thin layers of alkali-free glass. The multi-layer glass capacitor can be fabricated by heating a plurality of capacitor layers above the annealing temperature of the glass to thermal bond the layers together. The edge margin of the buried electrodes can be selected to provide an adequate protection level from high-voltage flashover of the multi-layer glass capacitor. For example, an edge margin of 0.125″ can hold off about 10 kV in air.

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Patent Owner(s)

Patent OwnerAddress
SANDIA CORPORATIONP O BOX 5800 MS-0161 ALBUQUERQUE NM 87185

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown-Shaklee, Harlan James Albuquerque, US 12 7
Wilke, Rudeger HT Albuquerque, US 2 4

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