METHOD FOR FORMING METALLIZATION STRUCTURE

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United States of America

APP PUB NO 20170271173A1
SERIAL NO

15259504

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Abstract

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A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a first portion of the metallic powder layer to form a metal layer; and in the presence of oxygen, performing a second laser sintering on a second portion of the metallic powder layer to form a metal oxide layer to serve as a first dielectric layer.

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Patent Owner(s)

Patent OwnerAddress
WINBOND ELECTRONICS CORPTAICHUNG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HO, Yu-Hsuan Taoyuan City, TW 34 41

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