Laminate for a Printed Circuit Board
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United States of America Patent
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Feb 13, 2017
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Mar 21, 2016
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Abstract
A laminate for use in a printed circuit board is provided. The laminate comprises a conductive layer and a film that is positioned adjacent to the conductive layer. The film contains a thermoset polymer formed by reacting an aromatic polyester with a crosslinking agent that includes a maleimide compound. The aromatic polyester includes repeating units derived from an aromatic hydroxycarboxylic acid, aromatic dicarboxycarboxylic acid, aromatic diol, aromatic amide, aromatic amine, or a combination thereof.
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