COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

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United States of America Patent

SERIAL NO

15112751

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Abstract

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The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises

    i) at least a source of Fe3+ ions,ii) at least a source of Br− ions,iii) at least an inorganic acid, andiv) at least one etch refiner according to formula I

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBH10553 BERLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CLICQUE, Arno Berlin, DE 5 11
LAGER, Markku Berlin, DE 4 1
TEWS, Dirk Berlin, DE 12 32

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