ALL SURFACE FILM METROLOGY SYSTEM
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United States of America Patent
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Sep 28, 2017
app pub date -
Sep 2, 2016
filing date -
Mar 28, 2016
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Abstract
A system is configured to perform metrology on a front surface, a back surface opposite the front surface, and/or an edge between the front surface and the back surface of a wafer. This can provide all wafer metrology and/or metrology of thin films on the back surface of the wafer. In an example, the thickness and/or optical properties of a thin film on a back surface of a wafer can be determined using a ratio of a greyscale image of a bright field light emerging from the back surface of the wafer under test to that of a reference wafer.
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